Float-zone silicon is very pure silicon obtained by vertical zone melting. It is typically used for power devices and detector applications. Float-zone silicon is considered a high-purity alternative to crystals grown by the Czochralski process. Let’s take a look at the difference between a float zone wafer and one made via the Czochralski process.
The float Zone (FZ) method is based on the zone-melting principle and was invented by Theuerer in 1962. As a result, the production takes place under vacuum or in an inert gaseous atmosphere. When it comes to float zone wafers the concentrations of light impurities, such as carbon and oxygen, are extremely low.
The vast majority of the commercially grown silicon is Czochralski silicon. This is due to the fact that it offers better resistance of the wafers to thermal stress, the speed of production, the low cost, and the high oxygen concentration. The Czochralski method is named after J. Czochralski. He then determined the crystallization velocity of metals by pulling mono- and polycrystals against gravity out of a melt.
Whether it’s a float zone or Czochralski wafer, at Wafer World we have the wafers that you need. As a result, we have been providing wafers to customers across six continents in over 45 countries and we have been doing it for over 20 years. In fact, over the years we have established strong working relationships with Fortune 100 companies, universities, government labs, and worldwide brokerage houses. If you are looking for wafers for your next project, contact us today to learn more about our products and to place an order.
