Thin silicon wafers are crucial to today’s technology, but misconceptions prevent their adoption. Here, we’ll explain and debunk these myths.
Read MoreDeepSeek developed an AI model with the power to rival OpenAI’s, but does it really forego the need of AI chips made with an FZ wafer?
Read MoreUnderstanding Total Thickness Variation is crucial to assessing the quality of a double side polish wafer. Here, we’ll explain the concept.
Read MoreGaAs reclaim wafers are a great way to save costs for your project—but they’re not suitable for every application. Here are some of its limitations.
Read MoreThe double side polish wafer offers enhanced performance, which makes them ideal for some critical applications.
Read MoreLaser marking is a crucial step in wafer manufacturing—but it can fail at times. Here, we’ll explain some common laser marking errors and what we do if they occur.
Read MoreInP reclaim wafers are of the utmost quality because there are strict limitations to what type of wafer can be reclaimed and what cannot. Here’s a breakdown.
Read MoreGaAs reclaim wafers unique properties make them resistant to radioactivity. Here, we'll explore the implications of this to the aerospace and military industry.
Read MoreFrom HEMTs to BJTs, the unique properties of an InP wafer make it the ideal substrate for manufacturing different types of transistors. Here are some.
Read Moreinp reclaim wafers are a great alternative to reduce costs—but they may not be recommended for certain applications. Here’s a breakdown of the uses of reclaimed wafers.
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