To produce an FZ wafer, silicon crystals must be grown through the float zone method. This technique allows a higher growth rate, eliminates oxygen levels that help minimize defects and controls resistivity throughout the entire crystal. This means that the wafers produced through this method are more effective, efficient, and have fewer defects. If you're looking the perfect type of wafer for your next project, then an FZ wafer might just be the wafer you're looking for. Here are the important things you need to know about it:
An FZ wafer is produced through the float zone method. A Float zone method is based on the zone melting principle that was invented in the year 1962 by Theurer. It’s a technique of growing silicon crystals in a way that helps minimize defects by eliminating the presence of light impurities, like oxygen and carbon.
FZ wafers have fewer defects because of its low oxygen and light impurity concentrations. Wafers that were produced using this process also have a higher growth rate and uniform dopant control in the entire crystal. Also, its production cost is cheaper and faster compared to the wafer produced through the CZ method.
FZ wafers are used in the following:
The float zone method is one of the best and popular ways to grow silicon crystal to produce a highly efficient and effective FZ wafer. That’s why the float zone method is widely used compared to the CZ method. Get all your FZ wafer needs at Wafer World. We offer high-quality wafers at the best price possible! Call us for inquiries or purchase wafers online!
