Since there are plenty of different semiconductors in the market today, there are also many ways for wafer manufacturing companies to test them. If you’re wondering how these manufacturers try semiconductor LSI chips, you’ve come to the right place. Here are the different methods they use to test these semiconductors.
An effective way to test semiconductor LSI chips with built-in self-test (BIST) circuits is with a BIST/DFT tester.
BIST is one of the DFT technologies or designs for testability. It’s possible to perform testing within an LSI chip’s circuits by constructing a course for producing a test pattern as part of the tester function and a circuit for comparing test results and expected values. BIST circuits include memory and logic BIST for testing logic circuits and memories.
Test cost reduction is the main benefit of BIST implementation. Since it’s possible to do testing with fewer test pins per chip, the increasing number of chips may be evaluated at once because most of the test patterns from an LSI tester are not required. As a result, a high-performance tester is no longer necessary, lowering the cost of a tester and probe card. Another benefit is that LSIs can provide high-speed test signals that enable testing at the pace of actual operation.
To achieve the best hardware configurations for continuity tests, AC parametric tests, DC parametric tests, and function tests, MJC offers testers for BIST/DFT. These testers allow the best hardware configurations by the specifications of memory BIST, logic BIST, etc. A high pin count, small size, and low cost are made possible by designing with consumer demands.
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