A wafer goes through several thinning and polishing processes to become a double side polish wafer. In this article, we will discuss those processes in detail. Here are the three processes involved in thinning and polishing wafers.
Wafer lapping is carried out after slicing. It aims to remove any damage on both sides of the wafer that were created by the saws during slicing. Several wafers can be lapped at the same time. They are placed in between two counter-rotating cast plates that contain a slurry of alumina abrasive grains with a specific distribution size. Lapping improves the flatness and smoothness of the wafers.
Lapping disturbs atoms to a depth of several micrometers, which damages the crystal structure of the wafer. Fortunately, the damage can be chemically removed through etching. This helps create a crystallographically flawless surface. There are two major types of etching: wet etching and dry etching.
Wafer polishing is the final step involved in thinning and polishing a wafer. It helps achieve a super-flat and mirror-like surface. Wafer polishing utilizes both chemical and mechanical techniques to refine a wafer. Two steps are involved in polishing a wafer: pre-polishing and final polishing. And there are two types of polishing:
In order to create a double side polish wafer, a wafer must go through DSP.
A double side polish wafer can be used for applications with high-flatness requirements. At Wafer World, we offer high-quality wafers, including double side polish wafers, at a reasonable price. Contact us for inquires!
