To produce a double side polish wafer, wafers must first go through several processes including lapping and polishing. Both processes contribute to thinning wafers to achieve the desired diameter and mirror-like surfaces. They also play a crucial role in removing unwanted materials on wafers’ surfaces. Here's what you should know about lapping and the different materials used in polishing wafers.
Wafer lapping is carried out using a hard metal lapping plate made of cast iron. The metal plate is covered in an abrasive slurry which revolves between the wafer and the plate. Two types of the plate can be used in the lapping process: a plate that has a flat smooth surface, and a plate with fine grooves machined on the surface of the plate.
Several types of paper can be used to achieve a double side polish wafer, including SiC papers. Abrasive paper polishing can help get rid of mechanical damage on a wafer’s surface.
After lapping the wafers, they will then go through polishing using a diamond slurry placed on a variety of different polishing cloths. Different types of polishing cloths gave different surface finishes and smoothness, but all can remove a certain degree of damage from the lapping process. What's great about using polishing cloths is that they're economical, damage-free, fast, and easy to use for various types of materials.It's widely used in metallographic specimen preparation, but it can also be used for other applications. You can use different polishing cloths depending on the surface quality you wish to achieve, the type of fiber used in the manufacturing of the cloth, removal rate, desired flatness, and lifetime.
Several lapping and polishing techniques can be used to achieve the surface quality you desire. At Wafer World, we offer a high-quality double side polish wafer at a reasonable price. Contact us for inquiries!
