The global market for InP reclaim wafers or silicon reclaim wafers was estimated to be worth $606.4 million in 2022 but is now expected to grow to $840.4 million by 2026 at a revised CAGR of 7.6% during the analysis period. One of the report's segments, 300mm, is anticipated to grow at an 8.2% CAGR and reach $584.8 Million by the conclusion of the analysis period. Following a thorough examination of the economic effects of the pandemic and the economic crisis it caused, the growth rate for the 200mm category is readjusted to a revised 5.9% CAGR for the following seven years.
Used test and prime wafers that have been stripped and repolished for reuse are referred to as silicon reclaim wafers. Silicon wafers are widely utilized in the semiconductor industry and are the basis for all modern electronic parts. The demand for silicon wafers, the fundamental component of semiconductors, is closely related to sales of electronic goods like computers, telecommunications equipment, consumer, automotive, and industrial electronics.
Although there are different sizes of silicon wafers available, there is a trend toward larger sizes that enable the fabrication of multiple chips on a single silicon, thereby lowering the cost per semiconductor chip. Wafers with a diameter of 12 inches (300 mm) currently make up the largest category. Given the rising cost of raw semiconductor-grade silicon and silicon wafer development, new processing technologies are assisting in lowering the risk of defect formation in silicon wafers.
Due to the significant cost savings offered compared to virgin test wafers, reclaiming wafers for testing applications is poised to benefit, given the significant number of wafers required for testing purposes. Reclaiming wafers in producing solar panels and photovoltaic cells is also anticipated to fuel demand. Opportunities for reclaimed wafers are predicted to increase as solar energy investments increase globally and technological advances allow the production of high-performance solar cells from scrap wafers.
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