The Importance of Laser Marking Thin Silicon Wafers While Producing Solar Cells

The shortage of fossil fuels and increasing environmental pollution have made solar cells an increasingly important player in energy generation worldwide. Laser marking thin silicon wafers plays a big role during the manufacturing of solar cells.

Here, we’ll explain the important role laser marking plays in solar cell manufacturing plays and explore the research behind it.

Problems During the Laser Marking Process

Laser marking is used to make ultra-thin silicon wafers for solar cell applications. Particularly, an electrothermal machining technique is used, called Wire Electrical Discharge Machining (WEDM).

This method helps remove material from the workpiece by creating non-stationary electrical discharges between the workpiece and the traveling wire tool electrode.

For solar cells to be as efficient as possible, silicon wafers must be cut with extreme precision, which WEDM makes possible. However, slicing wafers causes thermal damage and deteriorates their surface; polishing is necessary to remove the damage.

Nanosecond Laser Processing: An Attractive Alternative

Laser surface modification with nanosecond pulses is investigated as a possible pre-treatment method prior to polishing in order to shorten the polishing time. By doing this, the thermal damage caused by the WEDM process is lessened.

Research revealed that nanosecond laser processing could reduce the surface thermal damage depth by up to 50%. It was also noted that at lower laser power and pulse repetition rate values, the residual stresses also dramatically decreased.

Nevertheless, the process of effectiveness depends on the choice of suitable parameters, and the process of developing these is currently in the experimental stage.

Learn More About Laser Marking Thin Silicon Wafers for Solar Cells

Solar cell production must grow long before it can be considered an effective alternative to fossil fuels. Among them, it's to increase efficiency and to develop better production processes.

Among these, innovation in laser marking is an area that’s behind highly sought after. Here at Wafer World, we’re attentive to what’s to come in the industry. Reach out if you’d like to learn more about laser marking!