Semiconductors are a crucial piece of today’s technology, which has forced silicon wafer manufacturers to constantly strive to innovate and invest in technological advancement. For their part, silicon wafers have been evolving rapidly to meet the demands of an increasingly digital world.
Wafer packaging has experienced relentless innovation and problem-solving in the past few years. In this article, we’ll explore some of the changes in this area.
A semiconductor’s package is crucial to ensure its integrity during handling. Packages' primary purposes are facilitating chip handling, dissipating heat, distributing power and signals, enabling electrical connectivity, and providing protective covering.
The increasing demand for wafers has led to changes in the complexity and diversity of packet types in recent years. Packaging and testing procedures have had to change to keep up with chip size, power, and versatility.
Thanks to advanced packaging, multiple chips and components can be integrated into highly integrated, multifunctional subsystems. These technologies facilitate direct stacking without intermediary layers (3D), such as die-to-die, die-to-wafer, or wafer-to-wafer stacking, or side-by-side placement of chips and chipsets using a silicon bridge or interposer (2.5D).
This approach allows for:
In contrast, traditional packaging emphasizes single-die or few-die configurations adhered to a laminate substrate. These packages interface with the outside world through wire bond connections and larger feature sizes. They are inexpensive to produce and have a proven track record of reliability.
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The development of manufacturing, test technologies, and back-end packaging demonstrates how the semiconductor sector can always adapt and improve. Packaging processes have grown in precision, integration, and performance, aiming for cost-efficient and less intensive labor.
This is crucial to ensuring the quality of semiconductors until they reach their final purpose. At Wafer World, we’re committed to paying attention to the latest advanced packaging techniques. Contact us today to learn more about our manufacturing processes!
