Polishing and planarization are important to produce ultra flat wafers, which will be used to create semiconductor substrate materials for the production of microelectronic components. Without this process, it would be impossible to enjoy electronic devices that are handy and slim. If you’re looking to employ flat wafers, then it’s important to know the polishing process it must go through to achieve the desired thinness. Read on to know more about the polishing process for semiconductor materials.
Silicon manufacturing is one of the key technologies of today, wherein a constant increase of chip surface area is expected; as well as the ability to increase the degree of integration of components. To make this possible, cutting down on structural widths are essential. The smallest the industry has ever worked with is 0.35.
CMP (Chemical Mechanical Planarization) or wafer polishing is one of the most common methods in removing surface damage from a wafer. This process can remove around 5 to 10 microns of silicon from the rear side of the wafer. There is a drastic decline in the micro-sized peaks and valley micro-damaged brought about by the grinding process. The materials needed for polishing are diamond liquid slurry and polishing pads. The process starts with a wafer held in place by a vacuum carrier, with the backside of the wafer exposed. Then, the wafer is slowly brought into contact with polishing pads on a spinning platen. Using a regulated downward force, the damaged layers of the wafer are carefully removed, creating powerful flat wafers for you.
Keeping ultra flat wafers damage-free can be challenging. But with wafer polishing, micro-damage can be removed effectively and safely. At Wafer World, you can get a wide range of high-quality wafers at the best price possible. Call us for inquiries or visit our website to purchase wafers online!
