Manufacturing devices with a germanium wafer requires careful attention to surface preparation. When annealing silicon wafers, there are several methods to be explored, including quartz tube lamps, induction heating, and resistance coating—but germanium wafers come with unique properties and extra surface preparation requirements.
Let’s review the characteristics of germanium substrates and why it is important to use a suitable annealing recipe for the application.
Wafer annealing is a process that repairs atomic level disorder from steps like ion implantation. This process is crucial for ensuring the quality and performance of semiconductor materials.
Germanium wafers come with unique requirements, making the list of effective methods for effective germanium wafer annealing restricted:
Wafer annealing is a crucial step in wafer manufacturing. It helps relieve stress in substrates, activate or move dopants, and densify deposited or grown films, among other benefits. Therefore, it’s crucial when creating devices like transistors or chips out of germanium wafers.
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