Understanding-TTV-in-Double-Side-Polish-Wafer

Understanding Total Thickness Variation in Double Side Polish Wafers

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January 22, 2025

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Total Thickness Variation (TTV) is a critical parameter in semiconductor manufacturing—especially when it comes to a double side polished wafer. TTV measures how uniformly thick a wafer is across its surface, guaranteeing the caliber and functionality of semiconductor devices.

This is significant because variations in thickness can cause inconsistencies during the manufacturing process, influencing alignment, pattern transfer, and material deposition. Here, we’ll explain in detail what TTV is, how it is measured, and why it is essential for DSP wafers

Double Side Polish Wafer

What Is Total Thickness Variation?

Total Thickness Variation is the difference between the maximum and minimum thickness measurements made across the surface of a wafer. It is essential to figure out how uniformly a wafer has been processed and measured in micrometers (µm).  

For example, a wafer with a TTV of 5 µm indicates a 5 µm gap between its thickest and thinnest points. In semiconductor manufacturing, achieving low TTV is essential because even small deviations can cause serious problems in later processing stages and the finished product.  

Why Is TTV So Important in Double Side Polished Wafers?

Polishing DSP wafers on both sides achieves a high level of smoothness and flatness. Measuring the TTV on both sides is crucial because uniformity is crucial to guaranteeing the steady operation of semiconductor devices.  

High TTV can cause yield loss and unpredictable performance because of uneven electrical characteristics.

How is TTV Measured?

TTV is usually measured using specialized equipment that can measure thickness at several locations on the wafer's surface. Common approaches for getting accurate measurements include mechanical probing and laser interferometry.  

TTV is subject to strict specifications set by manufacturers to guarantee that wafers fulfill the standards for various applications.

Measuring TTV in Double Side Polish Wafer

Understanding the Quality of Our Double Side Polish Wafer

Total Thickness Variation is a critical metric in the semiconductor industry, particularly for double-side polished wafers. At Wafer World, we aim to produce high-quality semiconductor devices while minimizing costs and maximizing efficiency, so achieving low TTV is essential.

If you’d like to understand more about how we ensure the quality of our materials, contact us today! We’re eager to help.

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