What Types of Laser Marking Are Used in the Semiconductor Manufacturing Process?

The process of assembling semiconductors involves minute details: wafers must be flexible, thin, bur-resistant, and long-lasting. There must be strict controls over the production environment, as well as stringent quality assurance measures. In this very demanding process, laser marking became a key player in optimizing production.  

Using lasers makes manufacturing semiconductors more tolerable. To help you understand that, we’ll talk about the types of lasers used in wafer manufacturing and why they’re so important.

The Types of Semiconductor Laser Marking

In the production of semiconductors, a variety of semiconductor laser types are employed. These lasers have a wide range of features and applications and are designed to fulfill specific roles.  

Among the most widely used semiconductor lasers are the following:  

• Solid State Laser: Because of their great power and use of ores as the laser medium, these lasers are the most widely used. The device pulses light through the medium to produce a precise, focused beam by honing the wavelength.  

• Fiber Laser: These lasers have a reputation for cutting, engraving, and marking at very fast speeds. Using fiber as a resonator, fiber lasers use Yb-ion-doped fiber cladding to form an overlapping structure. It then primes the internal laser diode excitation for use.  

• Excimer Laser: The wavelength range of this deep ultraviolet laser is 126 nm to 351 nm. They are employed in the micro processing of polymers.

Learn More About Laser Marking

Advancements in semiconductor laser technology have given place to a variety of highly specialized tools, each with its own set of benefits for a determined step of production. That way, manufacturers like Wafer World can meet the industry quality standards, without sacrificing production times.

If you’d like to learn more about our wafer’s production process, reach out!